日本進(jìn)口晶圓搬運(yùn)機(jī)械手臂，晶圓對(duì)位系統(tǒng)

全自動(dòng)晶圓貼膜

標(biāo)置ESD特氟龍電鍍接觸晶片夾盤(pán)

應(yīng)對(duì)DBG工藝：貼膜后再撕BG膜

貼膜動(dòng)作：自動(dòng)拉膜和貼膜

晶圓臺(tái)盤(pán)：通用(一體式)特氟龍防靜電涂層接觸式臺(tái)盤(pán)；或硅膠臺(tái)盤(pán)，或陶瓷臺(tái)盤(pán)

Wafer Thickness

150 ~ 725 um

Wafer material

Si, SiC

Wafer Type

Single Flat, Double Flat or V-Notch

Tape Type

Blue Tape or UV Tape

Width :230、300 mm, Length:100 m; Thickness: 0.05 ~ 0.2 mm

Frame Type

6" DISCO or K&S, 8" DISCO or K&S; or Customer Specified

Mounting Theory

Roller Mounting

Wafer Place Accuracy

X-Y: +/- 0. 1 mm    Θ: +/- 0.1°

Input & Output

Dual Input Wafer Cassette / Single Output Frame Cassette

ESD Control

ESD Roller / ESD Wafer Chuck / ESD Ion Blower

Wafer Transfer

Horizontal Multi Axis Robot with Vacuum or Bernoulli Endeffector

Wafer Position & Warpage Intelligent Mapping in Cassette

Wafer Alignment

Fiber Sensor for Wafer Alignment

Control Unit

Standard Industrial PC with 17" Touch Panel LCD / Windows O/S

Power Supplier

Single Phase AC 220 V, 25A

Air Supplier

5.0 Kgf/cm2 CDA, 150 L/min

Machine Construction

Made of Full Aluminium Profile

Dimensions

1750 mm (W) × 1350 mm (D) × 1800 mm (H)

Net Weight

870 Kg